We provide precision wire bonding services using advanced wedge and ball bonding techniques for hybrid microcircuits and semiconductor devices. Our capabilities include gold and aluminum wire bonding with micron-level accuracy, ensuring high reliability and electrical performance. Used extensively in aerospace, automotive, and industrial electronics, our wire bonding process is conducted in controlled environments to maintain the highest quality standards.

Service Capabilities

1. Gold Wire bonding (0.7 Mill, 1 Mill & 1.5 Mill)
2. Aluminium Wire bonding (1 Mill, 5 Mill & 8 Mill)
3. Ribbon Bonding (2 Mil Thickness & 10 Mil Width)
4. Semi Auto Wire Bonder

Service Standards

1. MIL Standard 883
2. ISRO PAS 206

Modules

1. Digital modules
2. MEMS modules
3. RF modules
4. Communication modules
5. Analog to digital conversion
6. Analog devices
7. Power devices

Approvals

ISRO – URSC, SAC, VSSC, LEOS